Engis® Lapping / Polishing Systems

Lapping is a process that involves a medium (superabrasive and associated paste or liquid carrier) applied between the workpiece surface and a lapping plate.

While some of the diamond particles become embedded in the lapping plate to perform a fine grinding action, abrasive particles in lapping may also be continuously loose and rolling. As a result, lapped surfaces do not have directional scratch marks.

The lapping process works by pushing the points of the diamond grains into the work surface to abrade microchips of material. This kneading or abrading action on the work surface is repeated millions of times to produce effective material removal, as well as provide a simultaneous polishing action (especially when using abrasive particles as fine as 50 microns).

Benefits of Diamond vs. Conventional Abrasives:

Increased Productivity and Throughput: Diamond cuts and polishes faster than conventional abrasives, reducing cycle times by as much as 80%.

Cleaner Work Environment: Lapping with diamond produces less waste, significantly reducing housekeeping costs.

Easy to Clean: Clean cutting diamond slurry and lapping residue are easily removed from the workpiece without staining.

Lower Consumable Costs: Due to its efficiencies, lower amounts of diamond slurry are required to produce the same material removal rates.

Environmental Impact and Disposal Costs: With lower amounts of swarf being produced, the costs associated with disposing of waste and effluent are considerably reduced.