EAG-28DANX Series Grinding Machines

The EAG-28DANX Series from Engis Corporation is a fully automated dual-spindle grinding system designed for high-precision wafering of advanced materials like silicon carbide (SiC). This system enables simultaneous rough and fine grinding on both sides of a wafer, enhancing throughput and reducing the need for traditional lapping processes.

• Dual-Spindle Configuration: Performs rough and fine grinding in a single pass, improving efficiency and surface quality.

• In-Process Thickness Measurement: Offers both non-contact and contact gauge options for real-time monitoring and control of wafer thickness.

• Robust Cast Frame Structure: Ensures high rigidity and stability, critical for precision grinding operations.

• PC-Based Control System: Provides an intuitive interface for advanced process monitoring and control.

• Cassette-to-Cassette Automation: Facilitates seamless integration into automated production lines.

• SECS/GEM Interface Protocol: Ensures compatibility with semiconductor manufacturing communication standards.

• Real-Time Data Monitoring: Enables tracking of process parameters and facilitates quality control.