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Hyprez Conditioning Rings and Work Rings (Accesories)

For the Ultimate in Surface Finish

Engis manufactures two types of conditioning rings for lapping applications, ensuring optimal performance and precision:

  • Diamond-Plated Conditioning Rings:
    • Remove the previous layer of charged diamond, exposing a fresh surface for charging with new particles.
    • Can also bring the lapping plate back to its original flatness and parallelism.
    • Specifically designed for Hyprez HY composite lapping plates.
    • Engineered to consistently regenerate surface texture and flatness of composite lapping plates.
    • Eliminate varying results typically associated with conventional abrasive reconditioning.
    • Available for lapping plates from 12″ up to 42″.
  • Stainless Steel-Backed Ceramic Work Rings:
    • Serve to charge diamond particles into the lapping plate while holding parts in position.
    • Backed with 304 stainless steel for enhanced tensile strength.
    • Highly resistant to corrosion.
    • Available for lapping plates in sizes 12″, 15″, 18″, 24″, 28″, 36″, and 42″.

These rings comply with Engis’ ISO 9001:2008 Quality Management System, ensuring consistent high quality and performance.

Engis & Hyprez – A Reputation for Diamond Excellence

  • Global Expertise: Known worldwide for developing advanced diamond concepts that deliver superior surface finishes, Hyprez provides complete lapping systems and technical assistance.
  • Experience: With over 70 years in lapping with diamond, Engis and Hyprez are synonymous with high-precision, high-quality products.

To Complete Your System, Engis Also Offers:

  • MiniMiser®: Microprocessor-based spray unit for precise metering of diamond slurries at preset intervals.
  • Autostirrer: Keeps diamond slurries completely dispersed during the lapping process.
  • Precision Machines: Flat-lapping and polishing machines, parts, and accessories.
  • Process Development Lab: Offers cost-saving procedures tailored to your individual process.

Conditioning Rings and Accessories

Stainless Steel Backed Ceramic Conditioning Rings

Part Number Plate Dia. Outside Dia. Inside Dia. Height Designed For
LM0283 12” 5-5/8” 4-1/4” 1-5/8” 12” Dia Lap Plate with 3” Center Recess
LM0285 15” 7” 5-1/2” 1-5/8” 15” Dia Lap Plate with 4” Center Recess
LM1491 18” 8-1/2” 7-1/16” 1-5/8” 18” Dia Lap Plate with 4” Center Recess
LM0286 24” 11-1/4” 9-3/4” 2-1/8” 24” Dia Lap Plate with 4-1/2” Center Recess
LM0287 28” 13-7/8” 12” 2-1/8” 28” Dia Lap Plate with 4-1/2” Center Recess
32” Dia Lap Plate with 8” Center Recess
LM0312 36” 16-1/2” 14-1/2” 2-1/2” 36” Dia Lap Plate with 6-3/4” Center Recess
LM0313 42” 19-3/4” 17” 2-1/2” 48” Dia Lap Plate with 8” Center Recess

Diamond Plated Conditioning Rings (Custom sizes available upon request)

Part Number Plate Dia. Outside Dia. Inside Dia. Designed For
PCR-101 12” 5-5/8” 4-1/4” 12” Dia Lap Plate with 3” Center Recess
PCR-102 15” 7” 5-1/2” 15” Dia Lap Plate with 4” Center Recess
PCR-110 18” 8-1/2” 7” 18” Dia Lap Plate with 4” Center Recess
PCR-103 24” 9-3/4” 8-1/2” 24” Dia Lap Plate with 7” Center Recess
PCR-104 24” 11-1/4” 9-3/4” 24” Dia Lap Plate with 4-1/2” Center Recess
PCR-108 28” 13-7/8” 12” 28” Dia Lap Plate with 4-1/2” Center Recess
PCR-106 36” 16-1/2” 14-1/2” 36” Dia Lap Plate with 6-3/4” Center Recess
PCR-109 42” 19-3/4” 17” 42” Dia Lap Plate with 8” Center Recess

Conditioning Ring Accessories

Hyprez Parts Carriers: Designed to increase productivity while attaining precision surface flatness and finish. Available in FR-4 (recognized as a necessity for superior semiconductor finishes) and conventional phenolic plastic in various diameters and thickness. Machining is also available.

Hyprez Rubber Pads: Supports greater productivity when lapping parts of varying thickness. Designed to apply even pressure to all parts. Available in 1/2” thick soft rubber and 1/8” hard rubber.

 

Info and details at 0726 654 551

Write an email: nrotaru@gmail.com

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