EAG Grinding Systems

Our state-of-the-art offering, with fully automatic enhanced multi-spindle grinding system (Engis’s Hyprez® EAG Model), provides a low capital and operating expenditure solution for high precision wafering, giving an economic benefit to customers. The machine includes non-contact, in-situ thickness measurement techniques for targeted wafer thickness control. The aim is to produce ultra-flat wafers in a fully automatic cassette-to-cassette operation for grinding SiC wafers on both sides and to develop tailored ‘Grind-to-CMP Processes’ for all wafers sliced by any wafering techniques.

Benefits:

Fully automatic single spindle grinder
In-process non-contact thickness measurement
Stiff cast frame structure
PC-based machine
Automatic dressing system
SECS/GEM interface protocol
Real-time data monitoring

Specifications:

Wheel Spindle: 9.5 kW / 4,000 rpm
Work Table Spindle: 1.5 kW / 260 rpm
Work Table Size: 200 mm
Wheel Size: 303 mm
Minimum Feed Speed: 0.1 μm/sec +
Resolution: 0.0001 mm (0.1 μm)
Automatic Measuring System: 1 Probe / 0.1 μm (resolution) / 5 mm (max height)
Automatic Dressing System: 400 rpm / 200 W / ø90 + 30 mm (Option)
Full Automatic System
Machine Size: 2,200 x 1,800 x 2,300 mm
Machine Weight: 3,900 kg